MS-CF16 2.5-inch Pico-ITX Motherboard

MS-CF16 2.5-inch Pico-ITX Motherboard

Description

The MSI IPC MS-CF16 V3.0 is a compact 2.5-inch Pico-ITX board with Intel Alder Lake-N / Amston Lake / Twin Lake SoC – ideal for fanless, energy-efficient industrial and embedded applications.

It offers dual display output (HDMI + LVDS/eDP), 2.5 GbE and GbE LAN, TPM 2.0 and wide temperature support down to -40 °C (Amston Lake SKU).

The MSI IPC MS-CF16 V3.0 Pico-ITX board combines state-of-the-art Intel SoC technology (Alder Lake-N N97 / Amston Lake X7433RE / Twin Lake N150) with an extremely space-saving 101 × 73 mm form factor. Thanks to onboard LPDDR5 memory up to 16 GB and integrated graphics, it is ideally suited to demanding edge computing, digital signage and automation applications.

Dual display support allows simultaneous operation of HDMI (up to 3840 × 2160 @ 30 Hz) and LVDS/eDP (up to 1920 × 1200 @ 60 Hz). Two USB 3.2 ports (Gen 2 and Gen 1), two USB 2.0 ports and SATA 3.0 allow flexible connection of peripherals and storage media. Two COM ports (RS-232/422/485, 0 V/5 V/12 V) and 16-bit GPIO complete the industrial I/O profile.

Expandability is ensured by an M.2 B-Key slot (2242/3042, PCIe x1/SATA + USB 3.2 Gen 2) and an M.2 E-Key slot (2230, PCIe x1 + USB 2.0). The integrated TPM 2.0 controller (Infineon SLB 9672) ensures a secure system configuration. Power is supplied via DC-IN 12 V.

With an operating temperature of -10 °C to +60 °C (N97/N150) or -40 °C to +70 °C (Amston Lake) and CE, FCC Class B, BSMI, VCCI, RCM, UKCA and IC certifications, the MS-CF16 V3.0 is ideally suited to worldwide industrial use. Supported operating systems are Windows 11 IoT Enterprise 24H2 LTSC (64-bit) and Linux (on request).

Technical data

Environment
Mechanical
Weight 0.30 kg
Dimensions (W x D x H) 101 × 73 mm (Pico-ITX)
Power / Battery
Serial / Parallel Ports
SATA / USB
Audio / LAN
Video
Size / Resolution / Luminance
Viewing Angles
Touchscreen
Power Requirement
Power Requirement DC-IN 12 V
OS Support
OS Support Windows 11 IoT Enterprise 24H2 LTSC (64-bit); Linux (on request)
LCD Display
CPU / Chipsets / Graphics
CPU Intel Alder Lake-N N97 (QC, 12 W, 2.0 GHz to 3.6 GHz) / Twin Lake N150 (QC, 6 W) / Amston Lake X7433RE (QC, 9 W)
Chipset Integrated in SoC
Graphics Intel HD Graphics (depending on CPU), LVDS dual channel 18/24-bit, eDP, HDMI
Storage 1× SATA 3.0; 1× M.2 B-Key 2242/3042 (PCIe x1/SATA + USB 3.2 Gen 2)
Memory
Memory LPDDR5 4800 MHz, onboard, single channel, up to 16 GB
LAN / WLAN
LAN 1× 2.5 GbE Realtek RTL8125BG-CG + 1× GbE Realtek RTL8111K-CG, RJ-45
WWAN / Bluetooth
Expansion
IPC 1
Expansion IPC
Motherboard
Qualification
Certification CE, FCC Class B, BSMI, VCCI, RCM, UKCA, IC
I/O
Serial Port 2× COM (internal): COM1–2 RS-232/422/485, 0 V/5 V/12 V
USB Port 2× USB 3.2 Gen 2 x1 + 1× USB 3.2 Gen 1 (rear); 2× USB 2.0 (internal)
LAN 1× 2.5 GbE Realtek RTL8125BG-CG + 1× GbE Realtek RTL8111K-CG, RJ-45
Video Port 1× HDMI (up to 3840 × 2160 @ 30 Hz); 1× LVDS/eDP (up to 1920 × 1200 @ 60 Hz)
TPM Infineon SLB 9672VU2.0 / SLB 9672XU2.0 (depending on SKU)
Audio Realtek ALC897 High Definition Audio Codec
Expansion Bus 1× M.2 E-Key 2230 (PCIe x1 + USB 2.0); 1× M.2 B-Key 2242/3042 (PCIe x1/SATA + USB 3.2 Gen 2 + USB 2.0)
Wi-Fi Bluetooth via M.2 E-Key (PCIe x1 + USB 2.0, 2230)
Fan 1× system fan header
Environmental
Operating Temp. -10 °C to +60 °C (N97/N150, airflow 0.7 m/s); -40 °C to +70 °C (X7433RE)
Storage Temp. -20 °C to +80 °C (N97/N150); -40 °C to +80 °C (X7433RE)
Relative Humidity 10 – 90 %, non-condensing
Touch Screen
Storage