MS-CF13 Mini-ITX Motherboard

Description

The MSI IPC MS-CF13 is a fanless Mini-ITX motherboard with Intel Alder Lake-N & Twin Lake-N SoC – for energy-efficient, low-profile industrial applications with triple display, 6× COM and 12 V DC input.

With DDR5 SO-DIMM up to 16 GB, triple display (DP, HDMI/DP, LVDS/eDP), 6× COM, 2× 2.5 GbE LAN and onboard TPM 2.0, the MS-CF13 is ideal for compact control applications with low power consumption.

The MSI IPC MS-CF13 Mini-ITX motherboard (170 × 170 mm) is based on Intel Alder Lake-N (N97, Core i3-N305, Atom x7425E) and Twin Lake-N (N150, Core 3 N355) SoC processors in BGA package. A DDR5 SO-DIMM slot (4800 MHz, single channel) holds up to 16 GB of memory for energy-efficient embedded and edge computing applications.

Depending on the SKU, triple display support offers either two DisplayPort outputs + LVDS/eDP (SKU 1/5/6/8) or one DisplayPort + HDMI + LVDS/eDP (SKU 2/3/4/7/9). Resolutions range up to 4096 × 2304 @ 60 Hz (DP), 3840 × 2160 @ 30 Hz (HDMI) and 1920 × 1200 @ 60 Hz (LVDS). Two Intel I226-V 2.5 GbE LAN ports with RJ-45 provide reliable network connectivity.

The expansion and storage options comprise an M.2 B-Key slot (SATA/PCIe x1 + USB 3.2 Gen 2 + NANO-SIM holder, 2242/3042/2280) and an M.2 E-Key slot (PCIe x1 + USB 2.0, 2230) as well as a SATA 3.0 port. Six COM ports (COM1 RS-232/422/485; COM2–6 RS-232), two USB 3.2 Gen 2 ports (rear), one USB 3.2 Gen 1 port and two USB 2.0 ports complete the I/O profile.

Onboard TPM 2.0 (Infineon SLB9672VU2.0), 8-bit GPIO, 3 W audio amplifier and chassis intrusion complete the feature set. Operating temperature: 0–60 °C (airflow 0.7 m/s); certifications: CE, FCC Class B, BSMI, RCM, VCCI, UKCA. Windows 10/11 IoT Enterprise LTSC and Linux are supported. Power is supplied via DC-IN 12 V.

Technical data

Environment
Mechanical
Weight 0.51 kg
Dimensions (W x D x H) 170 × 170 mm (Mini-ITX)
Power / Battery
Serial / Parallel Ports
SATA / USB
Audio / LAN
Video
Size / Resolution / Luminance
Viewing Angles
Touchscreen
Power Requirement
Power Requirement DC-IN 12 V
OS Support
OS Support Windows 10 IoT Enterprise LTSC 21H2 (64-bit, ADL-N only); Windows 11 IoT Enterprise LTSC 24H2 (64-bit); Linux (on request)
LCD Display
CPU / Chipsets / Graphics
CPU Intel Alder Lake-N N97 (QC, 12 W) / Core i3-N305 (OC, 9–15 W) / Atom x7425E (QC, 12 W); Twin Lake-N N150 (QC, 6 W) / Core 3 N355 (OC, 9–15 W) – BGA, integrated SoC
Chipset Integrated in SoC
Graphics Intel UHD Graphics; 1× LVDS dual channel 18/24-bit (shared with eDP); 1× eDP; 2× DisplayPort or 1× DP + 1× HDMI (depending on SKU); 3 independent displays
Storage 1× SATA 3.0; 1× M.2 B-Key 2242/3042/2280 (SATA/PCIe x1 + USB 3.2 Gen 2 + SIM holder)
Memory
Memory DDR5 4800 MHz, 1× 262-pin SO-DIMM, single channel, up to 16 GB
LAN / WLAN
LAN 2× 2.5 GbE Intel I226-V, RJ-45
WWAN / Bluetooth
Expansion
IPC 1
Expansion IPC
Motherboard
Qualification
Certification CE, FCC Class B, BSMI, RCM, VCCI, UKCA
I/O
Serial Port 6× COM (internal): COM1 RS-232/422/485 (0 V/5 V/12 V); COM2–6 RS-232
USB Port 2× USB 3.2 Gen 2 (rear); 1× USB 3.2 Gen 1 (rear); 1× USB 2.0 (rear); 2× USB 2.0 (internal)
LAN 2× 2.5 GbE Intel I226-V, RJ-45
Video Port 2× DisplayPort (up to 4096 × 2304 @ 60 Hz) or 1× DP + 1× HDMI (up to 3840 × 2160 @ 30 Hz) depending on SKU; 1× LVDS/eDP (up to 1920 × 1200 @ 60 Hz)
TPM Infineon SLB9672VU2.0, onboard
Audio Realtek ALC897 Audio Codec (co-lay ALC888S); 3 W amplifier
Expansion Bus 1× M.2 B-Key 2242/3042/2280 (SATA/PCIe x1 + USB 3.2 Gen 2 + SIM holder); 1× M.2 E-Key 2230 (PCIe x1 + USB 2.0)
Wi-Fi Bluetooth via M.2 E-Key (PCIe x1 + USB 2.0, 2230)
Fan 1× CPU fan header + 1× system fan header
Environmental
Operating Temp. 0 °C to +60 °C (airflow 0.7 m/s)
Storage Temp. -20 °C to +80 °C
Relative Humidity 10 – 90 %, non-condensing
Touch Screen
Storage