MS-CF03 3.5-inch SBC Motherboard

Description

The MSI IPC MS-CF03 is a powerful 3.5-inch single board computer with Intel Alder Lake-N & Twin Lake-N SoC – developed for fanless industrial applications with ultra-wide voltage input (DC 9–36 V) and triple display output.

With DDR5 SO-DIMM up to 16 GB, 2× 2.5 GbE LAN, triple display (DP, HDMI, LVDS/eDP) and a wide DC input range, the MS-CF03 covers the most demanding edge computing scenarios.

The MSI IPC MS-CF03 3.5-inch SBC offers an impressive combination of computing power and industrial-grade connectivity in a compact 146 × 102 mm form factor. Supported processors include Intel Alder Lake-N (N97, N200, Core i3-N305, Atom x7425E) and Twin Lake-N (N150, Core 3 N355) with a DDR5 SO-DIMM slot for up to 16 GB of memory.

The graphics section allows simultaneous operation of three independent displays: DisplayPort (up to 4096 × 2304 @ 60 Hz), HDMI (up to 3840 × 2160 @ 30 Hz) and LVDS/eDP (up to 1920 × 1200 @ 60 Hz). Two Intel I226-V 2.5 GbE LAN ports, four USB 3.2 ports (2× Gen 2, 2× Gen 1), six USB 2.0 ports and two COM ports (COM1 RS-232/422/485, COM2 RS-232) enable extensive peripheral connectivity.

For expansion, an M.2 B-Key slot (2242/3042/2280) and an M.2 E-Key slot (2230) are available. A built-in SATA 3.0 port complements the storage options. The onboard TPM 2.0 controller (Infineon SLB9672VU2.0) provides platform security. A 6-watt audio amplifier is also integrated.

The wide DC input range of 9–36 V makes the MS-CF03 ideally suited to mobile and distributed installations. The operating temperature ranges from -10 °C to +60 °C (airflow 0.7 m/s). Certifications: CE, FCC Class B, BSMI, VCCI, RCM, UKCA. Supported operating systems are Windows 10 IoT Enterprise LTSC 21H2 (ADL-N only), Windows 11 IoT Enterprise LTSC 24H2 and Linux (on request).

Technical data

Environment
Mechanical
Weight 0.58 kg
Dimensions (W x D x H) 146 × 102 mm (3.5 inch)
Power / Battery
Serial / Parallel Ports
SATA / USB
Audio / LAN
Video
Size / Resolution / Luminance
Viewing Angles
Touchscreen
Power Requirement
Power Requirement DC-IN 9–36 V
OS Support
OS Support Windows 10 IoT Enterprise LTSC 21H2 (ADL-N only); Windows 11 IoT Enterprise LTSC 24H2; Linux (on request)
LCD Display
CPU / Chipsets / Graphics
CPU Intel Alder Lake-N N97 / N200 / Core i3-N305 / Atom x7425E; Twin Lake-N N150 / Core 3 N355 (BGA, integrated SoC)
Chipset Integrated in SoC
Graphics Intel UHD Graphics; 1× LVDS dual channel 18/24-bit; 1× eDP; 1× HDMI; 1× DisplayPort; 3 independent displays
Storage 1× SATA 3.0; 1× M.2 B-Key 2242/3042/2280 (SATA/PCIe x1)
Memory
Memory DDR5 4800 MT/s, 1× 262-pin SO-DIMM, single channel, up to 16 GB
LAN / WLAN
LAN 2× 2.5 GbE Intel I226-V, RJ-45
WWAN / Bluetooth
Expansion
IPC 1
Expansion IPC
Motherboard
Qualification
Certification CE, FCC Class B, BSMI, VCCI, RCM, UKCA
I/O
Serial Port 2× COM (internal): COM1 RS-232/422/485 (0 V/5 V/12 V); COM2 RS-232
USB Port 2× USB 3.2 Gen 2 + 2× USB 3.2 Gen 1 (rear); 6× USB 2.0 (internal)
LAN 2× 2.5 GbE Intel I226-V, RJ-45
Video Port 1× DisplayPort (up to 4096 × 2304 @ 60 Hz); 1× HDMI (up to 3840 × 2160 @ 30 Hz); 1× LVDS/eDP (up to 1920 × 1200 @ 60 Hz)
TPM Infineon SLB9672VU2.0
Audio Realtek ALC897 HD Audio Codec; integrated 6 W amplifier
Expansion Bus 1× M.2 B-Key 2242/3042/2280 (SATA/PCIe x1); 1× M.2 E-Key 2230 (PCIe x1, USB 2.0)
Wi-Fi Bluetooth via M.2 E-Key (PCIe x1 + USB 2.0, 2230)
Fan 1× system fan header (Smart Fan)
Environmental
Operating Temp. -10 °C to +60 °C (airflow 0.7 m/s)
Storage Temp. -20 °C to +80 °C
Relative Humidity 10 – 90 %, non-condensing
Touch Screen
Storage