MS-C926 Ultra-Slim Fanless Box PC (Intel Alder/Twin Lake-N, 19 mm, 3 Displays)

MS-C926 Ultra-Slim Fanless Box PC (Intel Alder/Twin Lake-N, 19 mm, 3 Displays)

Category

Description

At 19 mm high and 1.3 kg, the MSI IPC MS-C926 is one of the slimmest fanless box PCs with Intel Alder Lake-N / Twin Lake platform and three independent display outputs (2× DP + 1× HDMI 2.0). With 5G/LTE support via M.2 B-Key and IEC 60068-2 certification for digital signage and industrial edge computing.

The MSI IPC MS-C926 is based on Intel Alder Lake-N N97 (12 W), Twin Lake-N N150 (6 W), N250 (6 W) or Core 3-N355 (15 W) in BGA package with integrated SoC chipset. The cableless design and the extremely slim 19 mm form factor allow very compact integration into digital display systems, kiosk terminals and industrial edge devices.

One 262-pin DDR5-4800 SO-DIMM slot with up to 16 GB is available for memory. Storage options include one M.2 B-Key slot (PCIe x1/SATA, USB 3.2 Gen 2, with Nano-SIM holder for 5G/LTE, 2242/3042/2280) and one M.2 E-Key slot (PCIe x1/USB 2.0, 2230) as well as one 2.5″ HDD/SSD bay. Onboard TPM 2.0 is integrated.

The I/O equipment comprises 2× 2.5 GbE LAN (Intel I226-V), 1× HDMI 2.0 (up to 4096×2304@60 Hz), 2× DisplayPort (up to 4096×2304@60 Hz), 3× USB 3.2 Gen 1, 1× USB 2.0, 1× COM port (RS-232/422/485, 0/5/12 V) and Line-out. Four antenna openings enable WLAN/5G expansion.

The MS-C926 is certified to CE, FCC, RCM, VCCI, BSMI, UKCA and IC (EMC) as well as IEC 62368 CE(LVD)/BSMI (safety) and complies with IEC 60068-2 for vibration and shock. Operating temperature −10 to 50 °C, supply voltage DC-in 12–24 V. VESA and wall mounting are included as standard.

Technical data

Environment
Mechanical
Weight 1.3 kg
Dimensions (W x D x H) 180 × 255 × 19 mm
Power / Battery
Serial / Parallel Ports
SATA / USB
Audio / LAN
Video
Size / Resolution / Luminance
Viewing Angles
Touchscreen
Power Requirement
Power Requirement DC-in 12–24 V wide range (lockable DC jack)
OS Support
OS Support Windows 10 IoT Enterprise LTSC 21H2 (ADL-N only), Windows 11 IoT Enterprise LTSC 24H2, Linux
LCD Display
CPU / Chipsets / Graphics
CPU Intel Alder Lake-N N97 (12 W) / Twin Lake N150 (6 W) / N250 (6 W) / Core 3-N355 (15 W), BGA
Chipset Integrated in SoC
Graphics Intel UHD Graphics, 3 independent displays
Storage 1× M.2 B-Key (PCIe x1/SATA, USB 3.2 Gen 2, Nano-SIM for 5G/LTE) 2242/3042/2280, 1× M.2 E-Key 2230, 1× 2.5″ HDD/SSD
Memory
Memory DDR5 4800 MHz single channel, up to 16 GB, 1× 262-pin SO-DIMM
LAN / WLAN
LAN 2× 2.5 GbE RJ-45 (Intel I226-V)
WWAN / Bluetooth
Expansion
IPC 1
Expansion IPC
Motherboard
Qualification
Certification CE, FCC, RCM, VCCI, BSMI, UKCA, IC; Safety: IEC 62368 CE(LVD)/BSMI
I/O
Serial Port 1× COM (RS-232/422/485, 0/5/12 V)
USB Port 3× USB 3.2 Gen 1, 1× USB 2.0
LAN 2× 2.5 GbE RJ-45 (Intel I226-V)
Video Port 1× HDMI 2.0 (up to 4096×2304@60 Hz), 2× DisplayPort (up to 4096×2304@60 Hz)
TPM Infineon SLB9672VU2.0
Audio Realtek ALC897 HD Audio – 1× Line-out
Expansion Bus 1× M.2 B-Key (Nano-SIM/5G), 1× M.2 E-Key
Wi-Fi Bluetooth Optional (4 antenna openings, M.2 B-Key for 5G/LTE)
Fan Fanless design
Environmental
Operating Temp. -10 to 50 °C
Storage Temp. -20 to 80 °C
Relative Humidity 10–90 %, non-condensing
Touch Screen
Storage