R2314I-IM-A Industrial Motherboard (Mini-ITX, AMD Ryzen Embedded R2314, DDR4 ECC)

R2314I-IM-A Industrial Motherboard (Mini-ITX, AMD Ryzen Embedded R2314, DDR4 ECC)

Description

  • AMD Ryzen Embedded R2314 APU (BGA, soldered), 4 cores / 8 threads, up to 3.3 GHz
  • DDR4 up to 2667 MHz ECC, max. 32 GB, 2× SO-DIMM
  • 2× LAN (Realtek RTL8111H × 2), 4× DP (standard), LVDS/eDP optional
  • DC input 12–24 V, 6× serial ports (RS232/422/485), operating temperature 0–60 °C

The ASUS IoT R2314I-IM-A is a powerful industrial Mini-ITX motherboard in 170×170 mm format with a soldered AMD Ryzen Embedded R2314 APU. The 4-core processor with 8 threads offers significantly more computing power than the R1606 model and is suitable for more demanding edge computing and industrial automation tasks.

Two SO-DIMM slots accommodate up to 32 GB of DDR4 ECC memory (up to 2667 MHz). Four DisplayPort outputs as standard (alternatively 3× DP + LVDS or 3× DP + eDP). One PCIe 3.0 x8 slot and 2× M.2 offer solid expansion options.

Two Gigabit LAN ports, six serial ports (2× RS232/422/485 rear, 4× RS232 internal), SATA and CFast as well as a 12–24 V DC input make the board ideal for self-contained industrial systems and vehicle computers.

Operating temperature range 0–60 °C, certifications CE, FCC, VCCI, BSMI, RCM and CE-LVD for worldwide use.

Technical data

Environment
Mechanical
Dimensions (W x D x H) 170 × 170 mm
Power / Battery
Serial / Parallel Ports
SATA / USB
Audio / LAN
Video
Size / Resolution / Luminance
Viewing Angles
Touchscreen
Power Requirement
Power Requirement DC 12 V – 24 V
OS Support
OS Support Windows 10 (64-bit), Linux (Ubuntu, RedHat, Fedora, OpenSUSE)
LCD Display
CPU / Chipsets / Graphics
CPU AMD Ryzen Embedded R2314 APU, BGA (soldered), 4C/8T, up to 3.3 GHz
Chipset Integrated in APU
Graphics AMD Radeon Vega (integrated), 4× DP (standard, alternatively LVDS/eDP)
Storage 1× SATA 6Gb/s + 1× CFast, 2× M.2
Memory
Memory DDR4 up to 2667 MHz ECC, max. 32 GB, 2× SO-DIMM
LAN / WLAN
LAN 2× Gigabit LAN (Realtek RTL8111H)
WWAN / Bluetooth
Expansion
IPC 1
Expansion IPC
Motherboard
Qualification
Certification CE, FCC, VCCI, BSMI, RCM, CE-LVD
I/O
Serial Port 2× RS232/422/485 (rear panel), 4× RS232 (internal)
USB Port 2× USB 3.2 Gen2 + 2× USB 2.0 (rear panel)
LAN 2× Gigabit LAN (Realtek RTL8111H)
Video Port 4× DisplayPort (standard), alternatively 3× DP + LVDS or 3× DP + eDP
TPM SPI TPM header
Audio Realtek High Definition Audio
Expansion Bus 1× PCIe 3.0 x8 (x8 electrical), 2× M.2
Wi-Fi Bluetooth Not integrated
Fan CPU fan header, chassis fan header
Environmental
Operating Temp. 0–60 °C
Storage Temp. -40–85 °C
Relative Humidity 10–95 % at 40 °C
Touch Screen
Storage